EPYC Genoa-X with Zen 4 & 3D-V-Cache in 1H 2023, Genoa, Bergamo & Torino with SP6 support

EPYC Genoa-X with Zen 4 & 3D-V-Cache in 1H 2023, Genoa, Bergamo & Torino with SP6 support

A rumored roadmap of AMD’s next-gen EPYC server CPUs and platform has been released by AdoredTV. The roadmap lists upcoming server CPUs Genoa, Bergamo, Genoa-X and Turin, as well as a new platform called SP6.

AMD’s purported EPYC server CPU and platform roadmap spills the beans on Genoa-X, Torino, and SP6

We can’t confirm the validity of the roadmap slides, so treat this post as a rumor, but most of the details have also been previously reported by other leakers, so it’s worth sharing. First up is the EPYC Server CPU roadmap for 2021-2023. The roadmap not only lists EPYC server chips, but also the specific platforms they target. AMD recently released its latest SP3 platform chips, the EPYC 7003X “Milan-X”, based on the Zen 3 core architecture with 3D V-Cache.

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AMD EPYC Server CPU and Platform Roadmap Leaked. (Image credit: AdoredTV)

EPYC Zen 4(C) adds Genoa, Bergamo and Genoa-X

Moving forward, AMD intends to focus on the SP5 platform, which is based on the LGA 6096 socket and will feature at least two generations of processor lineups, Genoa and Bergamo. The AMD EPYC Genoa CPUs will feature up to 96 Zen 4 cores in 200-400W SKUs, while Bergamo will feature a total of 128 Zen 4 cores in 320-400W SKUs. The SP5 platform is a high-end design that includes both 1P and 2P support, up to 12-channel DDR5 memory, up to 160 PCIe Gen 5.0 lanes and 64 lanes for CXL V1.1+ and up to 12 PCIe Gen 3.0 provides lanes.

The same roadmap also mentions Genoa-X, something that was also mentioned by Moore’s Law is Dead in his video yesterday. The Genoa X CPUs are expected to go into production in late Q3 / early Q1 2023 and launch around mid-2023. They will feature a similar design methodology to the Milan-X chips with 3D V-Cache as “Large L3” is a prominent feature of the lineup. So, in total, SP5 will have three EPYC families.

What is SP6? A cost-optimized version of SP5 for edge servers

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At the same time, AMD is expected to introduce a new platform called SP6, which will be a more TCO-optimized offering for low-end servers. It will be a 1P solution offering 6-channel memory, 96 PCIe Gen 5.0 lanes, 48 ‚Äč‚Äčlanes for CXL V1.1+ and 8 PCIe Gen 3.0 lanes. The platform will feature Zen 4 EPYC CPUs, but only the entry-level solutions with up to 32 Zen 4 and up to 64 Zen 4C cores. Their TDPs range from 70 to 225W, so it looks like the SP6 platform is designed to support the entry-level variants of EPYC Genoa, Bergamo and even Torino CPUs. It will focus on density and performance/watt optimizations for leadership in the edge/telecom segment.

The roadmap confirms next-gen products such as EPYC Genoa-X, Torino for SP5 and SP6 platforms. (Image credit: AdoredTV)

Discovered in documentation by @olrak (via Anandtech Forums) it looks like the SP6 socket is very similar to the existing SP3 socket, so the packaging layout of the SP6 chips will also be similar compared to existing EPYC CPUs. They will not use the full 12-die layout like Bergamo does, but will stick to an 8-die layout like the existing pieces. While the socket looks the same, the internal pin layout has changed to LGA 4844 vs LGA 4096 (on SP3 sockets). Other measurements are the same at 58.5 x 75.4.

Most of these products are expected to be launched in the second half of 2022 and the first half of 2024. We can expect an official announcement of the new roadmap by AMD soon and a possible reveal during the Computex 2022 event, which is scheduled in a couple of weeks time.

AMD EPYC CPU Families:

last name AMD EPYC Naples AMD EPYC Rom AMD EPYC Milan AMD EPYC Milan-X AMD EPYC Genoa AMD EPYC Bergamo AMD EPYC Torino AMD EPYC Venice
family brand EPYK 7001 EPYK 7002 EPYK 7003 EPYC7003X? EPYC 7004? EPYC 7005? EPYC 7006? EPYC 7007?
family start 2017 2019 2021 2022 2022 2023 2024-2025? 2025+
CPU architecture Zen 1 zen 2 Zen 3 Zen 3 Zen 4 Zen 4C Zen 5 Zen6?
process node 14nm GloFo 7 nm TSMC 7 nm TSMC 7 nm TSMC 5 nm TSMC 5 nm TSMC 3 nm TSMC? open minded
platform name SP3 SP3 SP3 SP3 SP5/SP6 SP5/SP6 SP5/SP6 open minded
Power outlet LGA 4094 LGA 4094 LGA 4094 LGA 4094 LGA 6096 (SP5)
LGA XXXX (SP6)
LGA 6096 (SP5)
LGA XXXX (SP6)
LGA 6096 (SP5)
LGA XXXX (SP6)
open minded
Max core count 32 64 64 64 96 128 256 384?
Maximum thread count 64 128 128 128 192 256 512 768?
Maximum L3 cache 64MB 256MB 256MB 768MB? 384MB? open minded open minded open minded
Chiplet design 4 CCDs (2 CCXs per CCD) 8 CCDs (2 CCXs per CCD) + 1 IOD 8 CCDs (1 CCX per CCD) + 1 IOD 8 CCDs with 3D V-Cache (1 CCX per CCD) + 1 IOD 12 CCDs (1 CCX per CCD) + 1 IOD 12 CCDs (1 CCX per CCD) + 1 IOD open minded open minded
memory support DDR4-2666 DDR4-3200 DDR4-3200 DDR4-3200 DDR5-5200 DDR5-5600? DDR5-6000? open minded
memory channels 8 channels 8 channels 8 channels 8 channels 12 channels (SP5)
6-channel (SP6)
12 channels (SP5)
6-channel (SP6)
12 channels (SP5)
6-channel (SP6)
open minded
PCIe Gen Support 64 gen 3 128 gen 4 128 gen 4 128 gen 4 160 Gen 5 (SP5)
96 Gen 5 (SP6)
160 Gen 5 (SP5)
96 Gen 5 (SP6)
open minded open minded
TDP range 200W 280W 280W 280W 200W (cTDP 400W) SP5
70-225W SP6
320W (cTDP 400W) SP5
70-225W SP6
480W (cTDP 600W) open minded

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